PLASMA TREATMENT
Plasma is recognized as the fourth state of matter, distinct from the traditional solid, liquid, and gaseous phases, and naturally occurs in environments such as stellar surfaces and the Earth's ionosphere. While macroscopically remaining electrically neutral, plasma consists of a complex mixture of high-energy free electrons, neutral atoms, molecules, excited radicals, and ultraviolet radiation generated during ionization and dissociation reactions.
The active species within a plasma environment—including ions, electrons, excited metastable nuclides, and photons—interact directly with material surfaces. Low-temperature plasma surface treatment combines chemical etching, micro-cleaning, and physical sputtering to modify substrate characteristics, thereby enhancing surface wettability, removing organic contaminants, and grafting functional chemical groups.
ADVANTAGES OF PLASMA APPLICATION
Targeted Surface Functionalization: Surface modification is restricted to an ultra-thin layer (ranging from a few to several tens of nanometres), imparting specialized functional characteristics without altering the mechanical or physical bulk properties of the substrate.
Broad Substrate Versatility: Highly adaptable across diverse material types, including metals, engineering plastics, glass, elastomers, and advanced polymers.
Operational Simplicity & Process Control: Features a straightforward process workflow, user-friendly operation, excellent process repeatability, and high operational stability.
High Processing Efficiency: Characterized by rapid cycle times, high chemical reaction rates, and uniform surface coverage.
Eco-Friendly & Cost-Effective: Operates entirely as a 100% dry process—eliminating water consumption, chemical solvents, and hazardous waste emissions.
ATMOSPHERIC PLASMA TREATMENT
PM-V82 DVG3
The PM-V82 DVG3 atmospheric plasma cleaning system utilizes low-temperature plasma state technology to modify surface characteristics (within tens of nanometers) without changing the inherent bulk properties of the substrate. Active plasma components (ions, electrons, excited radicals, and UV photons) perform chemical micro-etching, surface activation, and contaminant cleaning to significantly enhance surface wettability and bonding adhesion.
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Targeted Surface Modification: Modifies only the surface layer (tens of nanometers), preserving matrix integrity.
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Broad Substrate Compatibility: Effective on metals, plastics (PP, PVC, PET, PC, PE, PTFE), glass, ceramics, and rubber.
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High Process Efficiency: Fast reaction rates, high processing uniformity, and seamless online line integration.
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Eco-Friendly & Cost-Effective: 100% dry process—no water consumption, zero chemical additives, and zero chemical pollution.
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VACUUM PLASMA TREATMENT
GD SERIES
GD series plasma cleaners are positioned industrial production . They are widely used in electronics, solar energy, automobiles, textiles, packaging and printing, biomedical and general industries. They are characterized by high processing efficiency and repeatability.
It is suitable for cleaning, activation, improving adhesion, adhesion and etching processes, and can be customized according to different needs of customers. Professional, efficient and stable solution.
